// equipment
封裝測試-設備
- Laser Marking
- Micro Wave Plasma
- Ball Mounter
- Package Saw
- POP Laser
- Flip Chip Underfill
- Laser Cut
- Wafer Backside Marking
// equipment
Micro Wave Plasma
// equipment
Ball Mounter
// equipment
Package Saw
// equipment
POP Laser
// equipment
Flip Chip Underfill
// equipment
Laser Cut
// equipment